Kuo: iPhone 15 Pro overheating due to thermal design flaw


You can’t forget the reports that some of the iPhone 15 Pro series phones overheated. People have been complaining about the hot-running Pro model since its launch.

Now, analyst Ming-Chi Kuo has released a note concluding that the A17 Pro chipset is not responsible for overheating, but rather a compromise Apple made in the design of the thermal system. The A17 Pro is built on TSMC’s advanced new 3nm node, which is very efficient, but obviously still produces more heat than the phone can handle.

Apple’s efforts to make the new iPhone Pro models lighter are to blame here. Apple reportedly had to reduce the heat dissipation area, which combined with titanium’s high heat conductivity results in poor heat management for the new chipset.

Apple will likely address throttling issues with a software update, which may manage but not fix the problem. The only way to keep a phone from overheating with a software update is to actually limit its performance and in turn power requirements so that it generates less heat.

Kuo’s theory doesn’t explain why only part of the phone is affected. We are not experiencing overheating in our review units and there are plenty of responses from people unable to replicate the problem on forums discussing this issue. Could it be that different phones have different cooling pad materials? We will make sure to follow up and keep you updated.

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